Double-Sided Grinding Equipment for Superior Flat Surface Processing

It is primarily used for high-precision double-sided grinding and polishing of sapphire, blue glass, ceramic sheets, crystals, semiconductors, and other hard and brittle materials.

• Precision Pressure Control High-precision pressure closed-loop control is achieved through PLC + PT + electrical proportional valve + low-friction cylinder.
• Upper Plate Shock Absorption Device A shock-absorbing elastic connection method suitable for both dynamic and static conditions.
• Lower Plate Support High-precision planar fluid bearing support.
• Pin Gear Transmission Pin gear transmission is used for both inner and outer gears, extending the service life of the carrier and facilitating easy maintenance.
• Upper and Lower Plate Water Cooling System The upper and lower plates adopt a water-cooled structure for temperature control, enabling high-pressure processing.
• Transmission System Four-motor synchronous drive, with adjustable speeds for the upper and lower plates, inner gear, outer gear (capable of both forward and reverse rotation), and featuring recipe functionality.

Our operations cover a wide range of technical services and specialized equipment sales, including technology development and exchange, graphic design, and the distribution of functional glass, new optical materials, and optical instruments. We specialize in providing high-end solutions for semiconductor devices, CNC machine tools, and experimental analysis instruments, alongside electronic components and photovoltaic equipment.